The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Mar. 15, 2006
Kenji Nagasaki, Tokyo, JP;
Kenji Nagasaki, Tokyo, JP;
Oki Electric Industry, Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device includes a semiconductor substrate, an electrode pad, a wiring, a conductive post, an insulator, a sealing resin, and an external electrode. The electrode pad is formed on the main surface of the semiconductor substrate. The wiring is formed above the semiconductor substrate, the wiring electrically connecting with the electrode pad. The conductive post is formed on the upper surface of the wiring, the conductive post electrically connecting with the wiring. The insulator is formed on the lateral surfaces of the conductive post and has a thermosetting property. The sealing resin is formed over the semiconductor substrate and the wiring and on the surface of the insulator. The external electrode is formed on the conductive post, the external electrode electrically connecting with the conductive post.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile