The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
May. 18, 2007
Rajiv Pethe, Mountain View, CA (US);
Michael A. Kast, Palo Alto, CA (US);
Scott C-j. Tseng, Fremont, CA (US);
Neil Bergstrom, Palo Alto, CA (US);
Julius Kozak, Antioch, CA (US);
Rajiv Pethe, Mountain View, CA (US);
Michael A. Kast, Palo Alto, CA (US);
Scott C-J. Tseng, Fremont, CA (US);
Neil Bergstrom, Palo Alto, CA (US);
Julius Kozak, Antioch, CA (US);
Southwall Technologies, Inc., Palo Alto, CA (US);
Abstract
In a method of forming micro traces, stamping techniques are employed to define a target pattern of the micro traces. The stamping is applied to electrically conductive material and may be limited to pressure, but a thermal stamping approach may be utilized. Following the stamping, a portion of the conductive material is removed, leaving the target pattern of conductive micro traces. In the pressure-application step, the pressure or the combination of pressure and temperature is sufficient to at least weaken the integrity of the bulk conductive material along the area of contact. Typically, this step causes shearing of the conductive material. Following the pressure-application step, excess conductive material is removed. In some embodiments of the invention, the thickness of the micro traces is not determined in a single step. The original thickness may be formed using a 'seed' material. The subsequent material buildup may occur after the target pattern is established.