The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Feb. 26, 2003
Kazuhiro Hayashi, Osaka, JP;
Kazuya Hisada, Osaka, JP;
Eiji Ohno, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
When a separation layer is formed using a stamper between a substrate and the stamper on a thick substrate, on the surface of which a rewritable recording multilayer film provided with signal guide grooves or pits and the signal guide grooves or pits are transferred from the stamper to the surface, variations in the thickness of the separation layer are produced due to unevenness of the distance between the stamper and the substrate. The surface of the kth signal recording layer of the kth signal substrate is shaped parallel to the surface with the guide grooves and pits of the (k−1)th signal recording layer on the (k−1)th stamper, a (k−1)th separation layer is formed between the two and then the (k−1)th stamper is peeled off. The distance between the surface with the guide grooves and pits of the (k−1)th signal recording layer and the kth signal recording layer becomes uniform, and therefore the thickness of the (k−1)th separation layer can be kept uniform.