The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2009
Filed:
Aug. 24, 2005
Tsung Yuan Chen, San Jose, CA (US);
Frederick Hayes Dill, San Jose, CA (US);
James Mac Freitag, Sunnyvale, CA (US);
Kuok San Ho, Santa Clara, CA (US);
Wipul Pemsiri Jayasekara, Los Gatos, CA (US);
Kim Y. Lee, Fremont, CA (US);
Mustafa Michael Pinarbasi, Morgan Hill, CA (US);
Ching Hwa Tsang, Sunnyvale, CA (US);
Patrick Rush Webb, San Jose, CA (US);
Tsung Yuan Chen, San Jose, CA (US);
Frederick Hayes Dill, San Jose, CA (US);
James Mac Freitag, Sunnyvale, CA (US);
Kuok San Ho, Santa Clara, CA (US);
Wipul Pemsiri Jayasekara, Los Gatos, CA (US);
Kim Y. Lee, Fremont, CA (US);
Mustafa Michael Pinarbasi, Morgan Hill, CA (US);
Ching Hwa Tsang, Sunnyvale, CA (US);
Patrick Rush Webb, San Jose, CA (US);
Hitachi Global Storage Technologies Netherlands B.V., Amsterdam, NL;
Abstract
An embodiment of the invention is a magnetic head with overlaid lead pads that contact the top surface of the sensor between the hardbias structures and do not contact the hardbias structures which are electrically insulated from direct contact with the sensor. The lead pad contact area on the top of the sensor is defined by sidewall deposition of a conductive material to form leads pads on a photoresist prior to formation of the remainder of the leads. The conductive material for the lead pads is deposited at a shallow angle to maximize the sidewall deposition on the photoresist, then ion-milled at a high angle to remove the conductive material from the field while leaving the sidewall material. An insulation layer is deposited on the lead material at a high angle, then milled at a shallow angle to remove insulation from the sidewall.