The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Apr. 25, 2005
Kazuo Hiyama, Kanagawa-ken, JP;
Takahiro Ikeda, Kanagawa-ken, JP;
Motohisa Abe, Ibaraki-ken, JP;
Hirokazu Karasawa, Kanagawa-ken, JP;
Masahiro Katayama, Tokyo, JP;
Kazuo Hiyama, Kanagawa-ken, JP;
Takahiro Ikeda, Kanagawa-ken, JP;
Motohisa Abe, Ibaraki-ken, JP;
Hirokazu Karasawa, Kanagawa-ken, JP;
Masahiro Katayama, Tokyo, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A three-dimensional ultrasonic inspection apparatus includes: a sensing device for ultrasonic inspection including an ultrasonic sensor as a transducer, in which a plurality of piezoelectric vibrators are disposed in a matrix or an array; a drive element selecting unit for selecting and driving a piezoelectric vibrator for producing an ultrasonic wave among the ultrasonic transducer; a signal detecting circuit for detecting the electric signal of the reflected echo by receiving the reflected echo from the joined area; a signal processing unit for subjecting the electric signal to signal processing and generating three-dimensional imaging data by causing the electric signals to correspond to mesh elements in a three-dimensional imaging region of the object to be inspected; and a display processing device for displaying the detection results and three-dimensional image data from the signal processing unit, while detecting the size and the position of the molten-solidified portion, and the size and the position of the weld defect of the joined area, from the intensity distribution of the three-dimensional imaging data generated by the signal processing unit.