The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2009

Filed:

May. 26, 2004
Applicants:

Takuma Hashimoto, Yawata, JP;

Masaru Sugimoto, Osaka, JP;

Ryoji Yokotani, Hirakata, JP;

Koji Nishioka, Kadoma, JP;

Yutaka Iwahori, Kadoma, JP;

Shinya Ishizaki, Hirakata, JP;

Toshiyuki Suzuki, Nara, JP;

Yoshiyuki Uchinono, Hirakata, JP;

Masahide Muto, Kobe, JP;

Satoshi Mori, Osaka, JP;

Hideyoshi Kimura, Hirakata, JP;

Inventors:

Takuma Hashimoto, Yawata, JP;

Masaru Sugimoto, Osaka, JP;

Ryoji Yokotani, Hirakata, JP;

Koji Nishioka, Kadoma, JP;

Yutaka Iwahori, Kadoma, JP;

Shinya Ishizaki, Hirakata, JP;

Toshiyuki Suzuki, Nara, JP;

Yoshiyuki Uchinono, Hirakata, JP;

Masahide Muto, Kobe, JP;

Satoshi Mori, Osaka, JP;

Hideyoshi Kimura, Hirakata, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/495 (2006.01); F21V 29/00 (2006.01); H05K 1/11 (2006.01); H05K 5/02 (2006.01); H05K 7/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light-emitting device () has a submount () and a plate for heat transfer () having a metallic plate (). The submount () has a mount base (), at least one light-emitting diode chip () mounted thereon and electrically conducting lines (-) formed on the mount base () to be connected electrically to the light-emitting diode chip (). A first plane () of the mount base () of the submount () is bonded thermally to the first plate (). For example, the plate is a circuit board having a metallic plate (), and the submount () is bonded thermally to the metallic plate () of the one of the at least one plate (). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base () for providing a plurality of heat transfer paths.


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