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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7494909 B1

PDFFull Text
Expired
Date of Patent:
Feb. 24, 2009

Filed:

Aug. 03, 2006

Method of manufacturing a chip

Applicants:

Chull Won Ju, Daejeon, KR;

Byoung Gue Min, Daejeon, KR;

Seong IL Kim, Daejeon, KR;

Jong Min Lee, Daejeon, KR;

Kyung Ho Lee, Daejeon, KR;

Young IL Kang, Daejeon, KR;

Inventors:

Chull Won Ju, Daejeon, KR;

Byoung Gue Min, Daejeon, KR;

Seong Il Kim, Daejeon, KR;

Jong Min Lee, Daejeon, KR;

Kyung Ho Lee, Daejeon, KR;

Young Il Kang, Daejeon, KR;

Assignee:

Electronics and Telecommunications Research Institute, Daejeon, KR;

Attorney:

Blakely, Sokoloff, Taylor & Zafman LLP

Primary Examiner:

Matthew Smith

Assistant Examiner:

James M Mitchell

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/76 (2006.01); H01L 21/46 (2006.01); H01L 21/44 (2006.01); H01L 29/40 (2006.01); H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a chip, a chip stack, and a method of manufacturing the same. A plurality of chips which each include: at least one pad formed on a wafer; and a metal layer which protrudes up to a predetermined thickness from the bottom of the wafer and is formed in a via hole exposing the bottom of the pad are stacked such that the pad and the metal layer of adjacent chips are bonded. This leads to a simplified manufacturing process, high chip performance and a small footprint for a chip stack.

Find Patent Forward Citations

Ju, Chull. (2009). Method of manufacturing a chip (U.S. Patent No. 7494909). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7494909

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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