The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Mar. 05, 2007
Kuniko Kikuta, Kanagawa, JP;
Makoto Nakayama, Kanagawa, JP;
Kuniko Kikuta, Kanagawa, JP;
Makoto Nakayama, Kanagawa, JP;
NEC Electronics Corporation, Kanagawa, JP;
Abstract
A method for manufacturing a semiconductor device is provided. The method includes forming a lower interconnection on a semiconductor substrate; forming a first interlayer insulation film in which the lower interconnection is buried; forming an MIM capacitive element on the first interlayer insulation film, the MIM capacitive element being formed by layering a lower electrode, a dielectric film, and an upper electrode; forming a second interlayer insulation film in which the MIM capacitive element is buried; forming via holes in the second interlayer insulation film so as to reach the lower electrode; forming a connection plug by filling the via hole with conductive film; and forming an upper interconnection to be connected to the connection plug above the second interlayer insulation film.