The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7494334 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 24, 2009

Filed:

Nov. 01, 2006
Applicant:

Ming-chiang Tsai, Taipei Hsien, TW;

Inventor:

Ming-Chiang Tsai, Taipei Hsien, TW;

Assignee:

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The mold assembly () is provided including a mold plate (), a mold core (), an elastic member () and an adjusting member (). The mold plate has a receiving cavity () and a receiving aperture () defined therein. The mold core is received in the receiving cavity. The elastic member, configured to restore the mold core to its previous position, is disposed between the mold plate and the mold core. The adjusting member is received in the receiving aperture, engaging with the mold core to drive the mold core to move relative to the mold plate.


Find Patent Forward Citations

Tsai, Ming-Chiang. (2009). Mold assembly (U.S. Patent No. 7494334). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7494334

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…