The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2009
Filed:
Sep. 29, 2003
Hiromichi Watanabe, Kobe, JP;
Yoshifumi Fukatsu, Kobe, JP;
Toshihiro Kasai, Toyota, JP;
Naoki Sugita, Tama, JP;
Naofumi Saito, Tama, JP;
Hiroyuki Yamanaka, Tokyo, JP;
Hiromichi Watanabe, Kobe, JP;
Yoshifumi Fukatsu, Kobe, JP;
Toshihiro Kasai, Toyota, JP;
Naoki Sugita, Tama, JP;
Naofumi Saito, Tama, JP;
Hiroyuki Yamanaka, Tokyo, JP;
Fujitsu Ten Limited, Kobe-shi, JP;
Kel Corporation, Tokyo, JP;
Shin-Kobe Electric Machinery Co., Ltd., Tokyo, JP;
Abstract
In order to suppress the occurrence of damage on a press-fit joining wiring board, a peak value of stress generated on the board in the case of a press-fitting a press-fit terminal into a through-hole is reduced so that it can not exceed the design standard value of the board. In the press-fit terminal in which a body part, retaining part, introducing part and forward end part are integrally formed, a cross-sectional area of the introducing part is reduced to be smaller than that of the retaining part, so that an intensity of the elastic force of the introducing part is decreased to be lower than that of the elastic force of the retaining part. Alternatively, on the wiring board, elastic material is filled into resin for combining sheet-like base material of the board so as to relieve an intensity of stress generated on the board itself.