The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2009

Filed:

Mar. 14, 2005
Applicants:

Gary S. Delp, Rochester, MN (US);

George Wayne Nation, Rochester, MN (US);

Inventors:

Gary S. Delp, Rochester, MN (US);

George Wayne Nation, Rochester, MN (US);

Assignee:

LSI Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An SIP for performing a plurality of hard and soft functions comprises standard IC die and custom platforms mounted to a substrate. Die are identified for each standard hard function, such as memory, processing, I/O and other standard functions and one or more user-configurable base platforms are selected that, when configured, execute the custom soft functions. Optionally, the substrate is laminated to the die and the platforms are attached to the substrate. Testing is performed by defining the configured base platforms coupled to logic representing the die and their connections and performing placement and timing closure on the combination.


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