The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 17, 2009

Filed:

Feb. 21, 2005
Applicants:

Koji Hayashi, Yamaguchi, JP;

Yoshiki Tanaka, Yamaguchi, JP;

Katsutoshi Hirashima, Yamaguchi, JP;

Seiichirou Takabayashi, Yamaguchi, JP;

Inventors:

Koji Hayashi, Yamaguchi, JP;

Yoshiki Tanaka, Yamaguchi, JP;

Katsutoshi Hirashima, Yamaguchi, JP;

Seiichirou Takabayashi, Yamaguchi, JP;

Assignee:

UBE Industries, Ltd., Ube-Shi, Yamaguchi, JP;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 3/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

[PROBLEMS] To provide a polyimidesiloxane solution composition that is excellent in defoaming ability and that can maintain the wettability of an outer lead bonded portion on a wiring board at a high level, even when it is applied on the surface of the wiring board and then cured, to form an insulating cured film. [MEANS FOR SOLVING PROBLEMS] A polyimidesiloxane solution composition which comprises an organic solvent, polyimidesiloxane soluble in the organic solvent, a curable components such as an epoxy compound and a polyvalent isocyanate compound, and a silicone defoamer, wherein the silicone defoaming agent comprises dimethylpolysiloxane, a polysiloxane compound having a hydrophilic group in a side chain or a terminal moiety, and a micro-powder silica.


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