The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 2009
Filed:
Oct. 20, 2004
Applicants:
Toshikazu Furui, Kawasaki, JP;
Naohisa Matsushita, Kawasaki, JP;
Inventors:
Toshikazu Furui, Kawasaki, JP;
Naohisa Matsushita, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/16 (2006.01); B32B 37/18 (2006.01); B32B 38/04 (2006.01); B26D 3/08 (2006.01); B31B 1/25 (2006.01); H01L 21/301 (2006.01); B32B 38/18 (2006.01); B26D 3/10 (2006.01); H01L 21/304 (2006.01);
U.S. Cl.
CPC ...
Abstract
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate to cut the laminate into elements.
Quick Actions:
Furui, Toshikazu. (2009). Method of cutting laminate with laser and laminate (U.S. Patent No. 7491288). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7491288
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile