The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2009

Filed:

Sep. 24, 2002
Applicants:

Mehryar Khalili Garakani, Westlake Village, CA (US);

Herbert M. Wildfeuer, Santa Barbara, CA (US);

Inventors:

Mehryar Khalili Garakani, Westlake Village, CA (US);

Herbert M. Wildfeuer, Santa Barbara, CA (US);

Assignee:

Cisco Technology Inc., San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04L 12/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Method and apparatus are described for differential MoIP bring-up and compression negotiation. A first differential, and, more particularly, overlapping, bring-up method involves initiating a bring-up of a first layer associated with a first modem; imposing a time delay; after the time delay, initiating a bring-up of a second layer associated with a second modem; and delaying completion of the first layer bring-up associated with the first modem until substantial completion of the second layer bring-up associated with the second modem. Two alternative differential, and, more particularly, sequential, V.8 modem relay link bring-up methods involve first bringing up a physical layer at a first leg while delaying bring-up of the physical layer of the second leg until completion of the bring up of the physical layer at the first leg, and thereafter completing XID exchange. All described methods and apparatus involve at least physical layer bring-up at both ends, and all optionally may involve the bring-up at either end also of error-correction (EC) layers and data compression layers.


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