The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2009

Filed:

Oct. 03, 2003
Applicant:

Kouji Harada, Hitachinaka, JP;

Inventor:

Kouji Harada, Hitachinaka, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02K 37/00 (2006.01); G11B 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The disclosure is concerned with a bonding method for bonding metallic members, which comprises the steps of: fitting a metallic members to another metallic member, followed by effecting preliminarily plastic bonding by means of a preliminarily bonding punch; and generating compression force in an axial direction of the members in the vicinity of the fitting portion of the bonding members after the preliminarily plastic bonding, and allowing part of the material of the bonding member to effect plastic-flow in such a manner as to fill a gap defined between the metallic members, so as to plastically bond the members; whereby the members are tightly integrated with each other.


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