The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Oct. 03, 2006
Steven J. Baumgartner, Zumbro Falls, MN (US);
Chun-tao LI, Rochester, MN (US);
Salvatore N. Storino, Rochester, MN (US);
Mankit Wong, Rochester, MN (US);
Steven J. Baumgartner, Zumbro Falls, MN (US);
Chun-Tao Li, Rochester, MN (US);
Salvatore N. Storino, Rochester, MN (US);
Mankit Wong, Rochester, MN (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Disclosed is a metal fill region of a semiconductor chip including a plurality of layer sets of the semiconductor chip, each set including a first metal fill layer, a second metal fill layer, and an insulation layer included disposed in planes parallel to each other, a plurality of metal fill pieces disposed in each of the metal fill layers, a metal fill piece axis of each of the pieces, wherein each of the axes perpendicularly intersects the planes of said metal fill layers and the insulation layer from any point of reference, and a metal fill pattern configured to position the pieces so that the axis of each piece in the first metal fill layer is linearly displaced of the axis of each piece in the second metal fill layer in at least one direction orthogonal to each of the metal fill axes.