The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2009

Filed:

Feb. 27, 2006
Applicant:

Heinz Pape, Aschheim, DE;

Inventor:

Heinz Pape, Aschheim, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device includes a semiconductor chip, where the semiconductor chip includes signal contact areas and supply contact areas. The signal contact areas are arranged on edge regions of the active top side of the semiconductor chip and are electrically connected to external signal exterior connections of the semiconductor device by connecting elements. The active top side of the semiconductor chip includes at least two supply collective electrodes made of annularly patterned metal foils which are arranged within the signal contact areas and are affixed in an electrically insulating manner on the top side. The supply collective electrodes are electrically connected to the supply contact areas of the semiconductor chip by internal connecting elements.


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