The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Nov. 03, 2005
Hajime Saiki, Aichi, JP;
Masahiro Iba, Iwakura, JP;
Hajime Saiki, Aichi, JP;
Masahiro Iba, Iwakura, JP;
NGK Spark Plug Co., Ltd., Aichi-Ken, JP;
Abstract
An electronic device comprised of a wiring board with a semiconductor component. The device is unlikely to have any defects, such as cracks to a solder joint portion during a reflow process of a flip-chip connection. The semiconductor component is flip-chip bonded at a pad array at a component side thereof to a pad array at a board side by way of an individual solder joint portion. In a solder resist layer at a semiconductor component side and a solder resist layer at a board side, D/Dis prepared to be in a range of 0.70 to 0.99, where D is a bottom inner diameter of an opening at the board side and Dis a bottom inner diameter of an opening at the component side.