The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Jul. 17, 2007
Eiichi Soda, Ibaraki, JP;
Eiichi Soda, Ibaraki, JP;
NEC Electronics Corporation, Kawasaki, Kanagawa, JP;
Abstract
A method of fabricating a semiconductor device of the present invention includes a step (S) of judging whether an interconnect pitch of an interconnect pattern having the smallest interconnect pitch out of all interconnect patterns to be formed in the insulating film is not larger than a predetermined value or not; a step (S) of determining the thickness of the lower resist film corresponding to the interconnect pitch, if the interconnect pitch is judged as being not larger than a predetermined pitch, in the step of judging whether the interconnect pitch is not smaller than the predetermined value; and a step (S) of forming, on the insulating film, the lower resist film having the thickness determined in step Sby using a multi-layered resist.