The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Oct. 13, 2006
Wen-chin Lee, Tayuan, TW;
Cheng-hsien Lin, Tayuan, TW;
Wen-Chin Lee, Tayuan, TW;
Cheng-Hsien Lin, Tayuan, TW;
Foxconn Advanced Technology Inc., Tayuan, Taoyuan, TW;
Abstract
A method for forming stacked via-holes on a printed circuit board includes the steps of: providing a printed circuit board having a conductive trace formed on a side surface thereof; forming a first copper-clad laminate on the side surface having the conductive trace; forming a number of first copper micro-via in a copper layer of the first copper-clad laminate; forming a second copper-clad laminate on the surface of the copper layer having the first copper micro-via of the first copper-clad laminate; forming a number of second copper micro-via in a copper layer of the second copper-clad laminate by a first laser on the basis of the first copper micro-via, each second copper micro-via being located corresponding to its correspondingly first copper micro-via; and removing corresponding resin layer portions of the first and second copper-clad laminates, using a second laser, to yield the respective stacked via-holes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile