The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Sep. 14, 2005
Kwang-ho Kim, Seoul, KR;
Jung-suk Lee, Gyeonggi-do, KR;
Yang-won Seo, Seoul, KR;
Yeol Choi, Seoul, KR;
Kwang-Ho Kim, Seoul, KR;
Jung-Suk Lee, Gyeonggi-do, KR;
Yang-Won Seo, Seoul, KR;
Yeol Choi, Seoul, KR;
Frontics, Inc., , KR;
Abstract
The present invention relates to a method of evaluating the fracture toughness of a material using the continuous indentation technique. In the method of this invention, the stress coefficient, strain hardening modulus and yield stress of the material are determined using the continuous indentation technique and, thereafter, the reduced elastic modulus (Er) of the material is calculated. The effective elastic modulus and the initial elastic modulus are calculated and, thereafter, the damage parameter is calculated using the void volume fraction. The critical elastic modulus and the characteristic fracture initiation point of the indentation depth are determined using the damage parameter and, thereafter, the fracture toughness of the material is evaluated. The present invention is advantageous in that the fracture toughness of a brittle material can be evaluated precisely using a nondestructive evaluation technique.