The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2009

Filed:

Oct. 05, 2006
Applicant:

Masashi Funakoshi, Osaka, JP;

Inventor:

Masashi Funakoshi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device of the invention includes a semiconductor element (), an interposer () having electrodes () arranged on a top face thereof in four directions and external electrodes () arranged on a bottom face thereof with the semiconductor element () mounted on the top face thereof, an adhesive material () fixing the semiconductor element () to the interposer (), metal nanowires () electrically connecting between electrodes of the semiconductor element () and the electrodes () of the interposer (), an insulating material () sealing a region containing the semiconductor element () and the metal nanowires (), and metal balls () mounted on the external electrodes (). Patterns () are designed on corners of a region surrounded by electrodes () arranged on the interposer () in four directions.


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