The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2009

Filed:

Mar. 23, 2005
Applicants:

Toshiyuki Ohashi, Wako, JP;

Keiichi Sato, Wako, JP;

Kazuhiro Miura, Wako, JP;

Inventors:

Toshiyuki Ohashi, Wako, JP;

Keiichi Sato, Wako, JP;

Kazuhiro Miura, Wako, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08J 3/20 (2006.01); C08L 101/00 (2006.01); C08K 7/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

An object is to provide a process for producing a carbon nanotube (CNT) reinforced composite material, wherein CNT is homogeneously dispersed in a resin to obtain the composite material having an excellent mechanical strength. Hydrophilic CNTsare dispersed in a first solventto prepare a first dispersion liquid. The dispersion liquidand a synthetic resin raw materialare added to a second solventand the resulting mixture is stirred to prepare a third dispersion liquidwhere a second dispersion liquidin which the synthetic resin raw materialis dissolved in the dispersion liquidis dispersed in the solvent. The solventsandare removed from the dispersion liquidto obtain a mixture of the hydrophilic CNTsand the synthetic resin raw materialThe mixture is molded to obtain the composite material in which the synthetic resin is reinforced with the hydrophilic CNTsThe second solventhas smaller solubility of the synthetic resin raw materialthan that of the solventis substantially not compatible to the solventand has volume larger than that of the solventThe dispersion liquidis sprayed on a substrate and the solventsandare removed to obtain the mixture and simultaneously to conduct molding of the mixture.


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