The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Jan. 25, 2005
Megumi Yamamura, Hyogo-ken, JP;
Toshihide Shimmei, Hyogo-ken, JP;
Tetsuya Kaji, Hyogo-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
A method of fabricating semiconductor device is described. There is provided a method of fabricating a semiconductor device including, sticking a first protective tape on a first surface of a semiconductor substrate, polishing a second surface of the semiconductor substrate faced to the first surface, sticking a second protective tape on the second surface of the semiconductor substrate, removing the first protective tape, dicing the semiconductor substrate from the first surface side to separate the semiconductor substrate to a plurality of semiconductor chips, sticking a third protective tape on the first surface of a plurality of the semiconductor chips, removing the second protective tape, and etching a cutting surface of the semiconductor chip and the second surface of the semiconductor chip by dry etching.