The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Apr. 27, 2006
Byoung-un Kang, Gyeonggi-do, KR;
Jai-hoon Kim, Seoul, KR;
Joon-mo Seo, Gyeonggi-do, KR;
Tae-hyun Sung, Seoul, KR;
Dong-cheon Shin, Seoul, KR;
Kyung-tae WI, Seoul, KR;
Byoung-Un Kang, Gyeonggi-do, KR;
Jai-Hoon Kim, Seoul, KR;
Joon-Mo Seo, Gyeonggi-do, KR;
Tae-Hyun Sung, Seoul, KR;
Dong-Cheon Shin, Seoul, KR;
Kyung-Tae Wi, Seoul, KR;
LS Cable Ltd., Gyeonggi-do, KR;
Abstract
A dicing die adhesive film for semiconductor of the present invention has a 3-layered structure including a first adhesive layer attached on the back of a semiconductor wafer; a second adhesive layer attached onto the first adhesive layer; and a dicing film attached onto the second adhesive layer, and therefore has an advantage that it can ensure reliability of the semiconductor packaging process since it may prevent the die-flying phenomenon and the poor pickup of the die in the dicing process and maintain a sufficient adhesive force between the die and the substrate upon die boding.