The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Oct. 10, 2006
Shuji Goma, Katsuragai, JP;
Hirozumi Gokaku, Kitakatsuragi-gun, JP;
Kozaburo Yano, Nabari, JP;
Masahiro Tadokoro, Toyohashi, JP;
Yasuhiro Nakai, Ise, JP;
Shuji Goma, Katsuragai, JP;
Hirozumi Gokaku, Kitakatsuragi-gun, JP;
Kozaburo Yano, Nabari, JP;
Masahiro Tadokoro, Toyohashi, JP;
Yasuhiro Nakai, Ise, JP;
Sharp Kabushiki Kaisha, Osaka, JP;
Shinko Electric Co., Ltd., Tokyo, JP;
Abstract
In order to obtain a thin plate manufacturing method capable of extremely increasing manufacturing efficiency by enlarging the production scale and remarkably reducing the manufacturing cost per unit area and an apparatus for manufacturing this thin plate, a method and an apparatus performing introduction of a substrate into a main chamber and discharge of the substrate from the main chamber through at least one subsidiary chamber () adjacent to the main chamber () are employed when manufacturing a silicon thin plate by dipping a surface layer part of the substrate into a silicon melt () in a crucible () arranged in the main chamber () for bonding silicon () to the surface of the substrate.