The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Apr. 14, 2005
Timothy S. December, Rochester Hills, MI (US);
Marc Bennett Fenwick, Commerce Township, MI (US);
Yoshiko Kobayashi-san, Ann Arbor, MI (US);
Scott Kubish, Michigan, MI (US);
Joann Lanza, Farmington Hills, MI (US);
Ippei Shinohara, Novi, MI (US);
Timothy S. December, Rochester Hills, MI (US);
Marc Bennett Fenwick, Commerce Township, MI (US);
Yoshiko Kobayashi-San, Ann Arbor, MI (US);
Scott Kubish, Michigan, MI (US);
JoAnn Lanza, Farmington Hills, MI (US);
Ippei Shinohara, Novi, MI (US);
BASF Corporation, Florham Park, NJ (US);
Toyota Motor Engineering & Manufacturing North America, Inc., Ann Arbor, MI (US);
Abstract
Disclosed is a method for evaluating chip performance of a cured coating system. In one embodiment, the method includes providing a coated substrate comprising a substrate and a cured film of a first coating composition thereon, measuring elastic work energy (W/W) of the cured film, and calculating a % C.P. of the cured film via the formula: % C.P.=7.61636−0.225473 (W/W) wherein a % C.P. of equal to or less than about 3.5% correlates to a total paint loss of equal to or less than 5% of a coating system comprising the first coating composition. The disclosed method predicts the gravelometer chip performance of a cured multilayer coating system comprising a first coating composition and a topcoat by measuring the measuring elastic work energy (W/W) of the cured first coating system alone. In one embodiment, chip performance can be predicted without topcoat application and independent of topcoat composition.