The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2009

Filed:

Mar. 30, 2005
Applicants:

Sang-wook Park, Seongnam-si, KR;

Joong-hyun Baek, Suwon-si, KR;

Hae-hyung Lee, Suwon-si, KR;

Hee-kook Choi, Seoul, KR;

Jin-yang Lee, Suwon-si, KR;

Inventors:

Sang-Wook Park, Seongnam-si, KR;

Joong-Hyun Baek, Suwon-si, KR;

Hae-Hyung Lee, Suwon-si, KR;

Hee-Kook Choi, Seoul, KR;

Jin-Yang Lee, Suwon-si, KR;

Assignee:

Samsung Electronics Co. Ltd., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 24/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a memory module, a gap filler for eliminating an air gap may be formed on an end of a PCB where a tab may be formed. The gap filler may be formed on a surface of a socket receiving the memory module. A grease may be coated on the tab to provide a heat conduction path away from the memory module.


Find Patent Forward Citations

Quick Actions:

Park, Sang-Wook. (2009). Memory module, socket and mounting method providing improved heat dissipating characteristics (U.S. Patent No. 7485006). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7485006

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