The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2009
Filed:
Dec. 07, 2006
Yoshiyuki Yamaji, Otsu, JP;
Hirokazu Noma, Yasu, JP;
Hiroyuki Mori, Yasu, JP;
International Business Machines Corporation, Armonk, NY (US);
Abstract
A semiconductor package that has a superior high frequency characteristics and that can obtain a large area for an internal wiring pattern is provided. According to the present invention, a semiconductor package includes: a multilayer printed wiring board, and an IC chip, mounted on the obverse face of the multilayer wiring board, and multiple bump terminals, mounted on the reverse face. Each bump terminalincludes an insulating corehaving a flat faceand a conductive coating deposited on all external surfaces except that of the flat face. The end faces of the conductive coatingsappear like rings around the insulating cores, and are soldered to annular connection padsformed on the reverse face of the multilayer printed wiring board. Viasare arranged immediately above the bump terminals, and clearance holes, the diameter of which is smaller than the diameter of the bump terminals, are formed in internal wiring patternsandto permit the passage of the vias
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile