The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2009

Filed:

May. 31, 2002
Applicants:

Makoto Amakai, Nagano, JP;

Iwao Sugiura, Nagano, JP;

Takanori Negishi, Nagano, JP;

Yasuhiro Kawashima, Nagano, JP;

Gen Kamurai, Nagano, JP;

Kazuyuki Imamura, Nagano, JP;

Inventors:

Makoto Amakai, Nagano, JP;

Iwao Sugiura, Nagano, JP;

Takanori Negishi, Nagano, JP;

Yasuhiro Kawashima, Nagano, JP;

Gen Kamurai, Nagano, JP;

Kazuyuki Imamura, Nagano, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structural analysis program which enables easy structural analysis in accordance with a finite element method based on data representing a two-dimensional shape. A two-dimensional model of a structure is produced in response to a manipulation input which designates a material arrangement pattern and a thickness of each layer of the structure. A three-dimensional model is produced by adding the designated thickness of each layer to the material arrangement pattern of the layer so as to make the material arrangement pattern three-dimensional and stacking the three-dimensionalized material arrangement pattern of each layer. A finite element model is produced by dividing the three-dimensional model into a plurality of voxels. The computer performs structural analysis based on the produced finite element model. Thereby, an analysis result of a multilayer structure defined by the two-dimensional model is obtained.


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