The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Jun. 15, 2007
Applicants:
Tetsuo Ito, Okaka, JP;
Takayuki Yoshida, Shiga, JP;
Toshiyuki Fukuda, Kyoto, JP;
Takao Ochi, Shiga, JP;
Inventors:
Tetsuo Ito, Okaka, JP;
Takayuki Yoshida, Shiga, JP;
Toshiyuki Fukuda, Kyoto, JP;
Takao Ochi, Shiga, JP;
Assignee:
Panasonic Corporation, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A production equipment includes a substrateplaced inside and having a plurality of semiconductor elementsmounted thereon, and a resin molding moldhaving a cavity. The moldhas resin injection portsand air release ports. Each of the resin injection portsis formed in a top surface portion of the cavity in the mold in association with the corresponding semiconductor element. Each of the air release portsis formed around each of the resin injection ports