The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Oct. 14, 2005
Azhar Aripin, Selangor, MY;
Norsaidi Sariyo, Selangor, MY;
Azhar Aripin, Selangor, MY;
Norsaidi Sariyo, Selangor, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A leadframe () for a semiconductor device has a radially extending leads () having inner lead portions () and outer lead portions (), and a dam bar () that mechanically connects the leads () together near the outer lead portions (). The inner lead portions () define an open area having a central region and the dam bar () defines a leadframe outer perimeter. A generally X-shaped die support member has arms () that extend from the leadframe outer perimeter and meet at the central region. A heat sink includes sections () that are formed between adjacent pairs of the die support member arms (). The heat sink sections () are connected to the die support member arms () with down set tie bars () such that the heat sink lays in a plane below a plane of the die support member arms ().