The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Aug. 29, 2003
Applicant:
Franklin J. Wall, Jr., Vacaville, CA (US);
Inventor:
Franklin J. Wall, Jr., Vacaville, CA (US);
Assignee:
Philips Lumileds Lighting Company, LLC, San Jose, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/22 (2006.01); H01L 31/12 (2006.01); H01L 27/15 (2006.01); H01L 29/26 (2006.01); H01L 23/52 (2006.01); H01L 21/00 (2006.01); H01L 21/50 (2006.01); H01L 21/48 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor light emitting device package includes a substrate with a core and a copper layer overlying the core. The light emitting device is connected to the substrate directly or indirectly through a wiring substrate. The core of the substrate may be, for example, ceramic, AlO, AlN, alumina, silicon nitride, or a printed circuit board. The copper layer may be bonded to the core by a process such as direct bonding of copper or active metal brazing.