The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2009

Filed:

Dec. 01, 2005
Applicants:

Yasushi Toyoda, Aichi, JP;

Nobuyuki Tanaka, Aichi, JP;

Inventors:

Yasushi Toyoda, Aichi, JP;

Nobuyuki Tanaka, Aichi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/50 (2006.01); B29C 65/54 (2006.01); B32B 37/12 (2006.01); B32B 37/16 (2006.01); B32B 38/04 (2006.01); B32B 38/10 (2006.01); B32B 37/22 (2006.01); B32B 37/30 (2006.01); B29C 65/56 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing a wiring board offering efficient operations of peeling and collection of a protective film as well as preventing a lowered yield. A method for manufacturing a build-up multilayer resin wiring board, which includes a taping process Sand a peeling process S. In the taping process Stwo sheets of substrate are supported and adjoined under the condition that the edges thereof are placed close to each other, and a tape is affixed so that the protective film may be connected on the edge of the substrate. In the peeling process Sthe protective films connected to each other are continuously peeled by sequentially lifting them via the tapes so that an interlayer insulation material may remain on the substrate.


Find Patent Forward Citations

Loading…