The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 27, 2009
Filed:
Aug. 30, 2004
Tae-hyun Kim, Asan-si, KR;
Youn-sung Ko, Cheonan-si, KR;
Young-kyun Sun, Cheonan-si, KR;
Dae-soo Kim, Cheonan-si, KR;
Kook-jin OH, Cheonan-si, KR;
Sang-woo Lee, Cheonan-si, KR;
Dong-bin Kim, Cheonan-si, KR;
Tae-Hyun Kim, Asan-si, KR;
Youn-Sung Ko, Cheonan-si, KR;
Young-Kyun Sun, Cheonan-si, KR;
Dae-Soo Kim, Cheonan-si, KR;
Kook-Jin Oh, Cheonan-si, KR;
Sang-Woo Lee, Cheonan-si, KR;
Dong-Bin Kim, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A controller may receive a wire disconnection signal from a wire bonding monitoring system and operate a wire clamp to clamp a disconnected wire. A series of operations, which may include a wire drawing operation, a wire tail forming operation and a ball forming operation, may be automatically performed. A sensor may measure the length of the wire drawn through the capillary and the location of a ball that may be formed at a wire tail. An auxiliary clamp may be installed between the wire clamp and the capillary for drawing the wire using sensor information.