The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2009
Filed:
Aug. 05, 2005
Kausar Banoo, Bethlehem, PA (US);
Seung H. Kang, Sinking Spring, PA (US);
Shahriar Moinian, New Providence, NJ (US);
Blane A. Musser, Topton, PA (US);
John A. Pantone, Birdsboro, PA (US);
Kausar Banoo, Bethlehem, PA (US);
Seung H. Kang, Sinking Spring, PA (US);
Shahriar Moinian, New Providence, NJ (US);
Blane A. Musser, Topton, PA (US);
John A. Pantone, Birdsboro, PA (US);
Agere Systems Inc., Allentown, PA (US);
Abstract
Techniques are presented for reliability analysis of integrated circuits. A circuit data file including a connectivity network with appended parasitic information is obtained. Circuit performance is simulated, based on the data file, to obtain simulated currents for metallic conductive paths of the circuit. Contextual representations of the paths are determined, and reliability analysis is performed on the contextual representations. The analysis can relate, for example, to electromigration, joule-heating, and/or fusing. The results of the analysis can be provided, for example, in the form of a report including recommended changes, such as width increases, to wires for which it is determined that reliability issues exist.