The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2009

Filed:

Mar. 02, 2006
Applicants:

Masami Murai, Nagano-ken, JP;

Xin-shan LI, Nagano-ken, JP;

Inventors:

Masami Murai, Nagano-ken, JP;

Xin-Shan Li, Nagano-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/45 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention is to provide a piezoelectric element, a method of manufacturing the same, a liquid-jet head, a method of manufacturing the same, and a liquid-jet apparatus, all of which prevent an inter-layer detachment in a lower electrode. A method of manufacturing a piezoelectric element, comprising the steps of: forming, on a substrate, a lower electrode configured of a plurality of layers which includes a metal layer with a limit thickness of 20 nm at least in its uppermost layer, the metal layer essentially containing iridium; forming a multi-layered piezoelectric layers by means of performing a piezoelectric film forming step a plurality times, the piezoelectric film forming step including an applying step of applying a piezoelectric precursor film onto the lower electrode, a drying step of drying the piezoelectric precursor film which has been applied thereon through the applying step, a degreasing step of degreasing the piezoelectric precursor film which has been dried through the drying step, and a baking step of making the piezoelectric precursor film, which has been degreased through the degreasing step, into a piezoelectric film by baking and crystallizing the piezoelectric precursor film; and forming an upper electrode on the piezoelectric layer.


Find Patent Forward Citations

Loading…