The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2009

Filed:

Sep. 27, 2007
Applicants:

Brian Smith, Melbourne, FL (US);

Hector Deju, Indialantic, FL (US);

Scott Burri, Cocoa, FL (US);

Larry E. Crider, Melbourne, FL (US);

Joseph Kreuzpaintner, Orlando, FL (US);

Gregory M. Jandzio, Melbourne, FL (US);

Walter M. Whybrew, Grant, FL (US);

Inventors:

Brian Smith, Melbourne, FL (US);

Hector Deju, Indialantic, FL (US);

Scott Burri, Cocoa, FL (US);

Larry E. Crider, Melbourne, FL (US);

Joseph Kreuzpaintner, Orlando, FL (US);

Gregory M. Jandzio, Melbourne, FL (US);

Walter M. Whybrew, Grant, FL (US);

Assignee:

Harris Corporation, Melbourne, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

At least one flexible appliance () and related method () for orthogonal, non-planar interconnections of at least a first electronic interface () disposed on a substrate () to an associated second electronic interface () positioned beneath the substrate (). The flexible appliance () is comprised of a planar body () having at least one electrical connector () extending from and orthogonally oriented relative to the planar body (). In one aspect of the invention, the electrical connector () is four electrical connectors (). There is at least one aperture () formed in the substrate () for allowing the first electronic interface () to be electrically interconnected to the associated second electronic interface (). The flexible appliance () is positioned on the substrate () by automated means. Contacts pads () on the resilient connector () are electrically connected to the second electronic interface () and the first electronic interface () by automated means such as soldering, thermo sonic bonding, or gap welding.


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