The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2009

Filed:

Jul. 18, 2003
Applicants:

Tomio Hirano, Miyagi, JP;

Nobuyuki Oikawa, Miyagi, JP;

Makio Onodera, Miyagi, JP;

Masao Ono, Miyagi, JP;

Hideki Sato, Miyagi, JP;

Yukihiro Onodera, Miyagi, JP;

Inventors:

Tomio Hirano, Miyagi, JP;

Nobuyuki Oikawa, Miyagi, JP;

Makio Onodera, Miyagi, JP;

Masao Ono, Miyagi, JP;

Hideki Sato, Miyagi, JP;

Yukihiro Onodera, Miyagi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A glass substrate excellent in strength properties and a glass cutting method are provided. When a glass substrate having predetermined size is to be formed by cutting a glass plate, any crack or chip is not generated on a cut face. Therefore, a pulverized powder is prevented from being generated from this portion. A glass substrate is obtained by cutting at least with laser light radiation so that a surface roughness of cut side faces and of the glass substrate are 50 nm or less and a depth of laser marks and on the cut side faces are 0.06 mm or more.


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