The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2009
Filed:
Sep. 06, 2005
Hubert Benzel, Pliezhausen, DE;
Heribert Weber, Nuertingen, DE;
Hans Artmann, Magstadt, DE;
Frank Schaefer, Tuebingen, DE;
Hubert Benzel, Pliezhausen, DE;
Heribert Weber, Nuertingen, DE;
Hans Artmann, Magstadt, DE;
Frank Schaefer, Tuebingen, DE;
Robert Bosch GmbH, Stuttgart, DE;
Abstract
A method is for producing a semiconductor component, e.g., a multilayer semiconductor element, e.g., a micromechanical component, e.g., a pressure sensor, having a semiconductor substrate, e.g., made of silicon, and a semiconductor component produced according to the method. To reduce the production cost of such a semiconductor component, in a first step a first porous layer is produced in the semiconductor component, and in a second step a hollow or cavity is produced under or from the first porous layer in the semiconductor component, with the hollow or cavity capable of being provided with an external access opening.