The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 20, 2009

Filed:

Aug. 02, 2005
Applicant:

Keith G. Newman, Sunnyvale, CA (US);

Inventor:

Keith G. Newman, Sunnyvale, CA (US);

Assignee:

Sun Microsystems, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus and method for non-destructive solder interconnect integrity monitoring that can detect existing fracture damage, identify new or incipient fractures, and be implemented across multiple component configurations. Said components can be implemented to detect, on a continuous basis, solder interconnect fractures as they occur during actual end-use, throughout the lifecycle of monitored components, rather than relying on a one-time electrical check prior to shipment.


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