Universal insert tool for fixing a bga package under test

Abstract

A universal insert for carrying a BGA package under test primarily comprises a meshed base, at least a latch, and a plurality of lift pins. The meshed base has a component cavity, a mounting surface and a plurality of aligning ball holes in the component cavity where the aligning ball holes are arranged in an array with equal pitch. The latch is disposed inside the meshed base to firmly hold BGA package under test. The lift pins are flexibly extended from the peripheries of the mounting surface of the meshed base. During probe testing, the component cavity accommodates the BGA package inside, at least some of the aligning ball holes are one-on-one aligned to a plurality of solder balls of the BGA package so that the solder balls are exposed from the corresponding aligning ball holes on the mounting surface. Therefore, the universal insert is not limited by the substrate dimension of a BGA package, nor by the number of solder balls, nor by the layout of solder balls and can hold various BGA packages with same ball pitch but with different specifications of BGA package.