The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
Mar. 06, 2006
Applicant:
Hyun-ki Kim, Chungcheongnam-do, KR;
Inventor:
Hyun-Ki Kim, Chungcheongnam-do, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are a stack semiconductor package manufactured by multiple molding that can prevent the breakage due to stress concentration at a connecting portion between separate semiconductor packages and a method of manufacturing the same. The stacked semiconductor packages are combined together through sealing resins by molding them multiple times, resulting in uniform stress distribution across substantially the entire interface between the semiconductor packages.