The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
Nov. 22, 2006
Applicants:
Yoshiteru Ochi, Kawasaki, JP;
Nobutaka Itoh, Kawasaki, JP;
Inventors:
Yoshiteru Ochi, Kawasaki, JP;
Nobutaka Itoh, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
A multilayer interconnection board includes a plurality of stacked insulation layers, wiring layers in the insulation layers, and via forming parts for interlayer connection, the via forming parts piercing the insulation layers. In the multilayer interconnection board, 0<L(L/3) is set, where Ldenotes the distance between center positions of a pair of neighboring via forming parts formed in the same insulation layer and Ldenotes the shortest separation distance between the pair of the via forming parts.