The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2009
Filed:
Mar. 28, 2006
Dean Tran, Westminster, CA (US);
Alan Hirschberg, Thousand Oak, CA (US);
Ha K. Demarco, Redondo Beach, CA (US);
Luis Rochin, Temecula, CA (US);
Thomas Chung, Redondo Beach, CA (US);
Mark Kintis, Manhattan Beach, CA (US);
Steven J. Mass, La Palma, CA (US);
Dean Tran, Westminster, CA (US);
Alan Hirschberg, Thousand Oak, CA (US);
Ha K. DeMarco, Redondo Beach, CA (US);
Luis Rochin, Temecula, CA (US);
Thomas Chung, Redondo Beach, CA (US);
Mark Kintis, Manhattan Beach, CA (US);
Steven J. Mass, La Palma, CA (US);
Northrop Grumman Corporation, Los Angeles, CA (US);
Abstract
Ultra-high speed semiconductors that are usually very thin and therefore very fragile still require connection to a circuit board and a heat transfer pathway. Ultra-high speed circuits and semiconductor devices are provided with a carrier plate formed on the backside of a wafer or substrate by a variety of deposition methods. The carrier plate is a series of metal layers, each being selected to enable the attachment of a relatively thick copper carrier plate to the backside of the substrate or wafer.