The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2009

Filed:

Jun. 18, 2007
Applicants:

Tsuyoshi Iwasa, Ichihara, JP;

Atsushi Funaki, Ichihara, JP;

Yoshiaki Higuchi, Ichihara, JP;

Inventors:

Tsuyoshi Iwasa, Ichihara, JP;

Atsushi Funaki, Ichihara, JP;

Yoshiaki Higuchi, Ichihara, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/082 (2006.01); B32B 15/20 (2006.01); B32B 27/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a laminate for a flexible printed wiring board excellent in signal response in the high frequency region. A laminate for a flexible printed wiring board having a three-layer laminated structure where a reinforcing layer (A), an electrical insulator layer (B) and an electrical conductor layer (C) are laminated in this order, wherein the electrical insulator layer (B) is made of a fluorocopolymer comprising repeating units (a) based on tetrafluoroethylene and/or chlorotrifluoroethylene, repeating units (b) based on a fluoromonomer excluding tetrafluoroethylene and chlorotrifluoroethylene, and repeating units (c) based on a monomer having an acid anhydride residue and the electrical conductor layer (C) has a surface roughness of at most 10 μm on the side being in contact with the electrical insulator layer (B). The laminate for a flexible printed wiring board is excellent in signal response in the high frequency region and excellent in flex resistance.


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