The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2009

Filed:

Feb. 27, 2007
Applicants:

Albert Auburger, Regenstauf, DE;

Jochen Dangelmaier, Beratzhausen, DE;

Cyrus Ghahremani, Regensburg, DE;

Thomas Lichtenegger, Alteglofsheim, DE;

Stefan Paulus, Zeitlarn, DE;

Jean Schmitt, Zeitlarn, DE;

Horst Theuss, Wenzenbach, DE;

Helmut Wietschorke, Regensburg, DE;

Inventors:

Albert Auburger, Regenstauf, DE;

Jochen Dangelmaier, Beratzhausen, DE;

Cyrus Ghahremani, Regensburg, DE;

Thomas Lichtenegger, Alteglofsheim, DE;

Stefan Paulus, Zeitlarn, DE;

Jean Schmitt, Zeitlarn, DE;

Horst Theuss, Wenzenbach, DE;

Helmut Wietschorke, Regensburg, DE;

Assignee:

Infineon Technologies AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B 6/42 (2006.01);
U.S. Cl.
CPC ...
Abstract

An optocoupler, for converting optical signals into electrical signals and vice versa, includes a package with a jack connector for receiving an optical waveguide. On a lower side of the package, surface-mountable outer contacts are arranged on an interconnection film. A mounting position for semiconductor chips, including one optical semiconductor chip and one application-specific semiconductor chip, is provided in the package on the optical axis of the optical waveguide. The optical semiconductor chip is aligned with the optical axis inside the package. The outer contacts are arranged outside the package on the flexible interconnection film. Between the mounting position and the outer contacts, the interconnection film includes a curved region which is embedded in the package material such that the surface-mountable outer contacts on the lower side of the package are freely accessible.


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