The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2009

Filed:

Dec. 20, 2006
Applicants:

Lance Stevens, Burnsville, MN (US);

Virgilio Velasco, Bloomington, MN (US);

Anand Prithivathi, Bloomington, MN (US);

Anthony Schmitz, St. Paul, MN (US);

Inventors:

Lance Stevens, Burnsville, MN (US);

Virgilio Velasco, Bloomington, MN (US);

Anand Prithivathi, Bloomington, MN (US);

Anthony Schmitz, St. Paul, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for integrated device testing can include the steps of: receiving wafer test data that identifies wafer test failures with the dice tested while part of a shared common substrate; receiving package test data that identifies test failures for at least a subset of the dice after the dice have been separated and assembled into different packages; identifying non-unique coverage test sets that include at least one wafer test or package test that generates failures that correlates with failures generated by another wafer test or package test for the same dice; and identifying unique coverage tests that include failures generated by wafer tests or package tests that do not correlate with failures generated by any other another wafer test or package test for the same dice.


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