The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2009

Filed:

Jan. 06, 2006
Applicants:

Liang-wen Wu, Taoyuan County, TW;

Ya-ping Tsai, Taoyuan County, TW;

Fen-ren Chien, Taoyuan County, TW;

Inventors:

Liang-Wen Wu, Taoyuan County, TW;

Ya-Ping Tsai, Taoyuan County, TW;

Fen-Ren Chien, Taoyuan County, TW;

Assignee:

Formosa Epitaxy Incorporation, Taoyuan County, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
Abstract

A light-emitting diode structure with transparent window covering layer of multiple films includes one (or several) first transparent covering layer(s) and one (or several) second covering layer(s), which are formed on the outside of the light-emitting diode chip. The light-emitting diode chip can emit light in more than two wavelengths to increase the transmission of the different wavelengths and the taking out efficiency of the light-emitting diode. The first transparent covering layer(s) and the second covering layer(s) are deposited each on the other on the outside of the light-emitting diode chip. The surface of the light-emitting diode with the covering layers is smooth. The contacting parts of the first transparent covering layer(s) and the second covering layer(s) are connected by a strong adhesive force and the contacting parts of the covering layer and light-emitting diode chip also are connected by a strong adhesive force.


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