The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
Dec. 28, 2005
Young Sam Park, Seoul, KR;
Hyung Suk Kim, Kyungki-do, KR;
Jung Kyu Park, Seoul, KR;
Ho Sik Ahn, Kyungki-do, KR;
Young June Jeong, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Bum Jin Kim, Kyungki-do, KR;
Young Sam Park, Seoul, KR;
Hyung Suk Kim, Kyungki-do, KR;
Jung Kyu Park, Seoul, KR;
Ho Sik Ahn, Kyungki-do, KR;
Young June Jeong, Kyungki-do, KR;
Hun Joo Hahm, Kyungki-do, KR;
Bum Jin Kim, Kyungki-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, Kyungki-Do, KR;
Abstract
A side-emission type LED package is provided. The LED package includes an LED chip, a lower structure, and an upper structure. The lower structure has a lower mirror and a transparent sealing member. The lower structure supports the LED chip. The lower mirror is extended upward and outward@ from the LED chip so as to reflect light from the LED chip upward. The transparent sealing member is formed around the LED chip inside the lower mirror. The upper structure is combined to an upper portion of the lower structure so as to reflect the light reflected upward by the lower structure to a radial lateral direction. As described above, the lower structure and the upper structure are separately provided and combined with each other, whereby molding efficiency of the sealing member is improved and the side-emission type LED package can be manufactured in an easy manner.